PPubMed10 Nov 2012Cited 10×

Prediction of fatigue life of high-heat-load components made of oxygen-free copper by comparing with Glidcop Fatigue life of high-heat-load components

Sunao Takahashi, Mutsumi Sano, Atsuo Watanabe, Hideo Kitamura

Abstract

By using the strain-range partitioning method, the fatigue life of high-heat-load components made of oxygen-free copper have been successfully predicted within a factor of two.

A figure from Prediction of fatigue life of high-heat-load components made of oxygen-free copper by comparing with Glidcop Fatigue life of high-heat-load components — fig. from the paper

§ The Valyu brief

The paper, in five minutes

Read from the full text via Valyu Contents

Fatigue life of oxygen‑free copper components can be predicted within a factor of two using strain‑range partitioning that accounts for creep‑fatigue interaction.

What’s new

i.Mechanical testing (tension, low‑cycle fatigue, creep) comparing OFC and Glidcop
ii.Application of the strain‑range partitioning method to predict OFC fatigue life under cyclic heat load
iii.Introduction of void‑ratio measurement as an experimental criterion for observed fatigue life
iv.Finite‑element elasto‑plastic creep analysis (ANSYS) to support life predictions

How they did it

The authors performed tension, low‑cycle‑fatigue and creep tests on OFC and Glidcop, then conducted electron‑beam irradiation fatigue‑fracture experiments on OFC while measuring void ratios. They applied the strain‑range partitioning method to calculate fatigue life and validated the predictions with FEM creep‑fatigue analysis using ANSYS.

What they found

Predicted OFC fatigue life for 550 W heat load: 467 cycles; observed life: 590 cycles (within factor 2)
Predicted OFC fatigue life for 450 W heat load: 697 cycles; observed life: 553 cycles (within factor 2)
Void ratio after 1000 cycles at 550 W was 19%
Creep rate of Glidcop at 90 MPa, 473 K: 1.5 × 10⁻⁶ s⁻¹, three orders of magnitude lower than OFC (3 × 10⁻³ s⁻¹)
At temperatures ≤473 K void ratio ≈1%; at 573 K void ratio rises to ≈5%

Caveats

✕Prediction accuracy limited to within a factor of two, not exact values
✕Study used a single OFC grade (C1011BE) and Glidcop AL15, limiting broader material applicability
✕Creep‑fatigue interaction examined only up to 673 K and within specific strain ranges
✕Void‑ratio criterion is empirical and may require further validation for other conditions

§ The Valyu brief

Reading the full paper and taking notes. This takes a few seconds…

§ Ask this paper

Ask a question about this paper

Valyu reads the full text and answers from what the paper actually says.

§ Related work in other archives

Prediction of fatigue life of high-heat-load components made of oxygen-free copper by comparing with Glidcop Fatigue life of high-heat-load components

The paper, in five minutes

Ask a question about this paper

Similar papers in all four archives

The paper, in five minutes

Similar papers in all four archives